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BD9478F product structure silicon monolithic integrated circuit this product is not designed protection against rad ioactive rays . 1/12 tsz02201 - 0f1f0c100010 - 1 - 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 tsz22111 ? 14 ? 001 www.rohm.com datasheet 12 3 4 5 6 7 8 clpf1 clpf2 cct pwm signal out (to led driver) cvcc cextpwm cpdim cvsync c o n n e c t o r vin pdim fvsync rlpf2 vcc extpwm pdim vsync pwmout gnd lpf ct led drivers series for lcd backlights pwm pulse generator for lcd panels BD9478F general description BD9478F is pwm pulse generator for lcd panel. this ic compares triangle waveform which is generated inside ic and external dc signal, and generates a pwm pulse. this pwm pulse is provided to led driver and controls led grayscale. pwm pulse frequency can be synchronized to external signal frequency inputted to sync terminal. even if this frequency g ets out of range, it works in the setting frequency, is protected and it always provides stable pwm pulse t o led driver. key specification operating power supply voltage range: 4.5v to 5.5v free run frequency: 150hz (ct=0.01f) operating current: 2ma (typ.) operating temperature range: -40 to +85 applications led backlight of monitor, tv, note pc, etc. features the signal that the frequency synchronizes with the vsync signal is output to pwmout. the pwm pulse is generated with the dc signal of a triangular wave and pdim generated with the lct capacitor. when the vsync frequency exceeds the stipulated range, it fixes by a set frequency. (fsync fpll=0.36*fplltyp , fsync> fplltyp*2.75 -> fpll=2.75*fplltyp) when vsync is a no signal input, the self-oscillation is operated by set frequency decided on the ct capacit ance. when the pulse signal is input to the terminal extp wm, it shifts automatically to external pwm mode. package w(typ.) d(typ.) h(max.) sop-8: 5.00mm x 6.20mm x 1.71mm pin pitch: 1.27mm typical application circuit figure 2. typical application circuit figure 1. sop-8
2/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25 ) parameter symbol ratings unit power supply voltage vcc 7 v operating temperature range ta(opr) -40 ~ +85 c storage temperature range tstg -55 ~ +150 c junction temperature tjmax 150 c power dissipation pd 689 1 mw *1 decreases 5.5mw/ c at ta=25 c or higher (when mounting a one-layer 70.0mmx70.0mm x1.6mm board) operating ratings (ta = 25 ) parameter symbol range unit power supply voltage vcc 4.5 5.5 v vsync input frequency range f_vsync 0.040 0.8 khz extpwm input pwm signal frequency range f_extpwm fct 30 khz the operating conditions written above are constant s of the ic unit. be careful enough when setting th e constant in the actual set. fct is dimming frequency that oscillates itself whe n vsync terminal is input no signal external components recommended range item symbol setting range unit vcc capacitance cvcc 0.1 ~ 10 f pll burst osc oscillation frequency setting capacitance ct 0.040 0.8 f the operating conditions written above are constant s of the ic unit. be careful enough when setting th e constant in the actual set. pin configuration marking diagram and physical dimension sop-8 figure 3. pin configuration figure 4. physical dimension 1 2 3 4 5 6 7 8 vcc extpwm pdim vsync pwmout gnd lpf ct lot no. d9478
3/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified, ta=25 c vcc=5v) parameter symbol limit unit condition min. typ. max. [whole device] circuit current during operation icc n 2 4 ma pdim=3v,ct=0.01uf vsync=extpwm=open [uvlo block] release voltage vuvlo 3.5 3.8 4.1 v vcc=sweep up hysteresis voltage vuhys 150 300 600 mv vcc=sweep dow n [pll block] oscillation frequency when vsync is input no signal fctns 142 150 158 hz ct=0.01f,lpf=0v triangle wave maximum voltage vcth 2.70 3.00 3.30 v fct=150hz triangle wave minimum voltage vctl 0.40 0.50 0.60 v fct=150hz synchronous signal abnormal judgment voltage, (at high frequency input) ct_sync _det1 2.612 2.750 2.888 v lpf=2.0v3.0v synchronous signal normal judgment voltage, (at high frequency input) ct_sync _okh 2.517 2.650 2.783 v lpf=3.0v2.0v internal rt voltage at synchronous signal, abnormal judgment when high frequency input vrtfh - 2.750 - v lpf=3v synchronous signal abnormal judgment voltage, (at low frequency input) ct_sync _det2 0.331 0.350 0.389 v lpf=1.0v0.1v synchronous signal normal judgment voltage, (at low frequency input) ct_sync _okl 0.414 0.450 0.486 v lpf=0.1v1.0v internal rt voltage at synchronous signal, abnormal judgment when high frequency input vrtfl - 0.360 - v lpf=0.25v switch voltage to internal fixed frequency vintf 0.10 0.15 0.20 v lpf=1.0v0.1v internal rt voltage at switched to internal fixed, frequency vrtfi - 0.900 - v lpf=0v input pin (extpwm,pdim,vsync) input high level vih 2.0 - 20 v input low level vil -0.3 - 0.8 v pull down resistance ripd 0.5 1.0 2.0 mq output pin (pwmout) output high level voh 4.3 4.85 - v io=-1ma output low level vol - 0.1 0.5 v io=1ma
4/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001 pin descriptions pin no pin name in/out function rating [v] 1 vcc - power supply -0.3~7 2 extpwm in external pwm signal input -0.3~20 3 pdim in dc signal input for internal pwm -0.3~20 4 vsync in synchronous signal input -0.3~20 5 ct out capacitance pin for vco -0.3~7 6 lpf in/out lpf output for pll -0.3~7 7 gnd - ground - 8 pwmout out pwm dimming signal output -0.3~7 pin esd type vcc extpwm / vsync /pdim ct

lpf gnd pwmout figure 5. pin esd type
5/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001 block diagram

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6/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001 typical performance curve 0 100 200 300 400 500 0 5 10 15 20 cct [nf] frequency fct [hz] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 100 150 200 250 300 350 400 fct [hz] pwmout jitter [us] 0 20 40 60 80 100 120 0 1 2 3 4 pdim [v] pwm duty [%] 0 1 2 3 4 4.0 4.5 5.0 5.5 6.0 vcc [v] operating current icc [ma] figure 7. operating current (icc) [ma] vs. vcc[v] figure 8. frequency fct[hz] vs. ct[nf] figure 9. pwm duty [%] vs. pdim[v] figure 11. start up waveform (free run mode) figure 12. extpwm mode waveform figure 10. pwmout jitter [s] vs. fct[hz] ct pdim extpwm pwmout f-200hz pwmout ct pdim vcc
7/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001 pin function pin 1: vcc power supply pin of the ic. input range is from 4.5 v to 5.5v operation starts at vcc=3.8v typ. or higher and shuts down at vcc=3.5v(typ.) or lower. pin 2: extpwm external pwm signal input terminal. in case of the following equation, the signal in put to extpwm is output directly to pwmout. the equation ; f(pll) < 2 * f(extpwm) f(extpwm) ; frequency of signal input to extpwm f(pll) ; frequency of signal that synchronizes wit h vsync signal pin 3: pdim dc signal input terminal to generate internal pwm s ignal. the pwm signal is generated with compare it with a triangular waveform in ic. if pdim input dc level is changed, pwm duty can be changed. pdim input dc voltage range is from 0.5v to 3.0v. ( pwm duty is changed from 0% to 100%) pin 4: vsync synchronous signal input terminal. the signal that synchronizes with the frequency of the signal input to vsync is generated with pll. a triangular wave is generated based on the frequen cy of this synchronized signal, and the pwm pulse is generated with compare it with the pdim si gnal pin 5: ct capacitor connection terminal that decides the osci llation frequency of vco.. please adjust the capacity of ct by the following e quation so that the voltage of the terminal lpf may become 0.9v when the frequency of the signal t hat synchronizes is input. pin 6: lpf low pass filter connection pin. the pulse signal output from phase comparator is sm oothed by low path filter, and it inputs to voltage . controlled oscillator (vco). pin 7: gnd ground pin of this ic. pin 8: pwmout pwm signal output pin. the pwm signal generated in ic is output. ] [ ] [ 5.1 uf hz f ct plltyp =
8/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001 about dimming function burst frequency free run function because pll is incorporated, free run operation is possible for burst frequency. pll circuit will operate like it synchronizes with the frequency of signal input to vsync pin. then, the voltage that is in proportion to the freq uency will be generated in lpf pin. when lpf pin voltage becomes 0.35v or lower, it wil l judge the external burst frequency is abnormal an d clumps with the frequency of fpllmin. then, pll frequency is change d to free run frequency. (note1) when the burst frequency becomes normal and lpf pin becomes over 0.9v, it will return to the state that synchronizes with the burst frequency.(note2) in the same way, when lpf pin becomes 2.75v or more, it will clump with the frequency of fpllmax. when the burst frequency becomes normal and lpf2 pin becomes 2.65v or lower, it will return to the stat e that synchronizes with the burst frequency. when lpf pin becomes 0.15v or lower, it will judge the external burst frequency is not inputted and sw itches to the frequency of fplltyp.(free run mode) note1 if fvsync is less than fpllmin, the input of vco is fixed to 0.36v inside ic, and pwm frequency is fixe d to fpllmin. however, since it is fvsync 9/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001
free run operation explanation for example, if you set ct=0.01uf (at this time, fpl ltyp is adjusted to 150 hz.) and f(vsync)=180hz, the lpf pin voltage becomes 1.2v. the built-in vco is proportional to the lpf pin vol tage. if vsync is inputted to low frequency and it become s lpf<0.35v (at this time, f<58hz),it will clump at f pllmin=58hz. however, since it is fvsync2.75v (at this time, f>343hz),it will clump at fpl lmax=343hz. when synchronous signal is not inputted to vsync ter minal, lpf voltage decreases and then it becomes lpf<0.15v (at this time, f<19hz), it oscillates typ ical frequency (at this time, f=150hz). note: please set f(vsync) frequency to satisfy the follow ing equations when you start up pll mode. and then, please change f(vsync) frequency. f(vsync) > fplltyp , fplltyp = 1.5/(ct[uf] ) [hz] figure 14.
10/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001 dimming signal automatic selection function in this ic, even if either pwm dimming signal or dc dimming signal is inputted into the duty pin, it i s automatically distinguished as dc or pwm in the ic. by detecting 4 cycles of the pwm signal within the 8 cycles of the burst frequency in the ic, it will switch automatically to pwm dimming. therefore, set the burst frequency in the ic as fol lows: (burst frequency in the ic(same fsync)) 2 x (externally inputted pwm signal (fextpwm)) also, if you do not detect 4 cycles of the pwm sign al within the 8 cycles of the burst frequency after switching to pwm dimming, it will automatically switch to dc dimming . (a) when (burst frequency in the ic) 2 x (externally inputted pwm signal) ? when (burst frequency in the ic ) R 2 x (externally inputted pwm signal) burst frequency in the ic burst ff output in the ic externally inputted pwm signal output dimming signal burst frequency 8 cycles pwm signal 4 cycles output comparator of triangle wave and pwm signal pwm dimming output burst frequency in the ic burst ff output in the ic external pwm signal burst dimming signal burst frequency 8 cycles pwm signal 4 cycles output comparator of triangle wave and pwm signal figure 15. figure 16.
11/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1.) although the quality of this product has been t ightly controlled, deterioration or even destructio n may occur if the absolute maximum ratings, such as for applied pressure and operation al temperature range, are exceeded. furthermore, w e are unable to assume short or open mode destruction conditions. if special mo des which exceed the absolute maximum ratings are e xpected, physical safely precautions such as fuses should be considered. 2.) the ic can destruct from reverse connection of the power supply connector. precautions, such as i nserting a diode between t he external power supply and ic power terminal, sho uld be taken as protection against reverse connecti on destruction. 3.) when attaching to the printed substrate, pay sp ecial attention to the direction and proper placeme nt of the ic. if the ic is att ached incorrectly, it may be destroyed. destruction can also occur when there is a short, w hich can be caused by foreign objects entering betw een outputs or an output and the power gnd. 4.) because there is a return of current regenerate d by back emf of the external coil, the capacity va lue should be determined af ter confirming that there are no problems with char acteristics such as capacity loss at low temperatur es with electrolysis conde nsers, for example by placing a condenser between t he power supply and gnd as a route for the regenera ted current. 5.) the potential of the gnd pin should be at the m inimum potential during all operation status 6.) heat design should consider power dissipation ( pd) during actual use and margins should be set wit h plenty of room. 7.) exercise caution when operating in strong magne t fields, as errors can occur. 8.) when using this ic, it should be configured so that the output tr should not exceed absolute maxim um ratings and aso. wit h cmos ics and ics which have multiple power source s, there is a chance of rush current flowing moment arily, so exercise c aution with power supply coupling capacity, power s upply and width of gnd pattern wiring and its layou t. 9.) this ic has a built-in temperature protection c ircuit (tsd circuit). the temperature protection c ircuit (tsd circuit) is only to cut off the ic from thermal runaway, and has not been designed to protect or guarantee the ic. therefore , the user should not plan to activate this circuit with continued operat ion in mind. 10.) if a condenser is connected to a pin with low impedance when inspecting the set substrate, stress may be placed on the ic, so there should be a discharge after each process. furthermore, when connecting a jig for the inspecti on process, the power must first be turned off before connection and insp ection, and turned off again before removal. 11.) this ic is a monolithic ic, and between each e lement there is a p+ isolation and p substrate for element separation. there is a p-n junction formed between this p-layer and each elements n-layer, which makes up various parasitic elements. for example, when resistance and transistor are con nected with a terminal as in figure 15: when gnd>(terminal a) at the resistance, or gnd>(te rminal b) at the transistor (npn), the p-n junction operates as a parasitic diode. also, when gnd>(terminal b) at the transistor, a pa rasitic npn transistor operates by the n-layer of o ther elements close to the aforementioned parasitic diode. with the ics configuration, the production of para sitic elements by the relationships of the electric al potentials is inevitable. the operation of the parasitic elements can also interfere with t he circuit operation, leading to malfunction and ev en destruction. therefore, uses which cause the parasitic elements to operate, such as ap plying voltage to the input terminal which is lower than the gnd (p-substrate), should be avoided. status of this document the japanese version of this document is formal spe cification. a customer may use this translation ver sion only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority figure 17. example of simple structure of monolith ic ic b c e adjacent other elements parasitic (pin b) gnd parasitic element (pin a) parasitic element resistor p substrate n gnd p n p (pin a) p n transistor (npn) b parasitic element gnd e c gnd p p n n n p n p substrate (pin b)
12/12 datasheet BD9478F tsz02201-0f1f0c100010-1- 2 ? 2012 rohm co., ltd. all rights reserved. 24. jul.2012 rev.00 2 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 9 4 7 8 f - xx part number package f:sop packaging and forming specification xx: please confirm the formal name to our sales. physical dimension tape and reel information ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 ( ) direction of feed reel 1pin (unit : mm) sop8 0.9 0.15 0.3min 4 + 6 ? 4 0.17 +0.1 - 0.05 0.595 6 4 3 8 2 5 1 7 5.0 0.2 6.2 0.3 4.4 0.2 (max 5.35 include burr) 1.27 0.11 0.42 0.1 1.5 0.1 s 0.1 s
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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